Post-CMOS processes including electroless gold plating and special package technique are implemented to enhance the biocompatibility and stability of the biosensor.
在标准CMOS工艺基础上,应用无电浸镀金改进传感电极的生物兼容性,并采用特殊封装技术提高芯片在溶液环境中的稳定性。
Fiber Bragg gratings (FBG) prepared in terms of a phase mask technique and the FBG temperature sensor with plating gold were introduced.
介绍了用相位掩膜方法制作光纤布拉格光栅(FBG)以及镀金的FBG温度传感器。
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