电路板(Multilayer PCB) 电金/沉金电路板(Gold Plating) 喷锡电路板(Free HASL PCB) 金手指电路板 ( Gold Finger PCB ) 产品能力(Capabilities) 工艺能力(PCB..
基于90个网页-相关网页
For protecting gold finger in the process of manufacturing PCB.
过锡炉和波峰焊过程中遮蔽保护金手指。
Good performance in adhesion, High Temperature Resistance, Solvent Resistance, Strong Holding Force, No Residual Adhesive Left. For protecting gold finger in the process of PCB.
粘性佳,耐高温、耐溶剂、保持力强、不残胶。;用于印刷线路板(PCB)过锡炉喷锡和波峰焊过程中遮蔽保护金手指。
应用推荐