Generally substrates are preheated to 160f to 200f for improve bonding.
一般来说基层被预热到160 '华氏度到200 '华氏度以改善粘接度。
To improve the interlayer bonding, increase physical indexes on the layers is one of the subjects for speeding placement.
改善层间结合，提高层面上的物理力学指标，是目前快速筑坝的课题之一。
This product can improve the performance of heat insulating board as well as the bonding strength of anti-cracking mortar. It is suitable for surface treatment of plastic extruded board.
本产品能够改善保温板性能，提高抗裂砂浆的粘结强度，适用于挤塑板的面层处理。
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