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The process of flip chip based on aluminum nitride is studied.
研究了以氮化铝为基板的倒扣封装的工艺。
The embedded active chip also can be realized by backside thinning and flip chip bonding.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
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