.0 中文名称 柔性层一(FLO) 英文名称 Flexible Layer One (FLO) 发布日期 2011-04-02 工作组 G1 起草人 SEBIRE, Benoist 备注 本规范适用于 GERAN-based systems
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A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
The flexible bone composite includes at least one polymeric layer and at least one calcium-containing layer.
该挠性骨复 合材料包括至少一个聚合物层和至少一个含钙层。
The adhesive sheet (5) for fixing the flexible printed wiring board (4) to the fixing sheet (6) has a pressure-sensitive layer at least on one side of its porous base.
将柔性印刷电路（4）固定在固定板（6）上的 胶粘剂片（5）在其多孔基材的至少一侧具有压敏胶粘剂层。
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