Putting on top ever-increasing amounts of data that needs to be processed and exchanged between systems adds measurably to the demand for more computing power and speed.
随着需要在系统之间处理和交换的数据不断增长，将需要更多的计算能力和更快的计算速度。
This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.
简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。
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