Because the etchedpattern will be effected by manyfactors, many technicaldifficulties such as gettingtheidealetched patternandmonitoring the etchingprocesshavenot been solvedyet.
In particular, the processes by which the circuit pattern is first projected on to a chip's surface lithographically, and then etched on to it chemically, will need to be altered to take account of the fact that the surface is curved.