etch pits density 蚀坑密度
The dislocation etch pits density(EPD) of copper single wires is related with corroded time, deformative extent and crystal orientation of material.
铜单晶线材中位错蚀坑密度与材料浸蚀时间，变形量以及晶体学取向有关。
The shape, distribution and density of etch pits on the (101) face was observed by metalloscope after chemical etching.
单晶，通过化学腐蚀和金相显微镜研究了（101）晶面蚀坑的形貌、分布特征及其密度的大小。
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