New HLX-1 resin Curometer has been designed and built, by which the curing conditions of T31-epoxy resin E51 system was optimized.

在新设计制造的HLX - 1型树脂固化仪上对t _(31) -环氧树脂e51进行了最佳配方和最佳条件的选择。

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The encapsulate composite for pulsed piezoelectric power supplier was investigated in this paper, in which a bisphenol A liquid epoxy EP828/E51 was resin matrix and aluminum oxide was filler.

本论文研究的复合封装材料以双酚A型环氧树脂EP828／E51作为基体，以氧化铝作为填充材料，有望替代纯环氧固化物作为脉冲压电电源用新型封装材料。

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