Currently developing the technology and products on a global scale has been widely used within the military, aerospace, construction, automotive, electronics, packaging areas.
目前开发出的技术及产品，已经在全球范围内广泛应用于军事、航空、建筑、汽车、电子产品及包装领域。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Widely applicable technology, stationery, food, toys, clothing, electronics, hardware, and other high-level internal and external packaging.
广泛适用于工艺、文具、食品、玩具、服装、电子、五金等内外高级包装。
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