Current density: unit under the plating area under current, usually the higher current density film thickness is thicker, but is high coating will scorched thick dry.
电流密度：单位电镀面积下所承受的电流，通常电流密度越高膜厚越厚，但是过高时镀层会烧焦粗燥。
The minimum dry film thickness of coating shall be 100 microns.
最低干膜涂层厚度应为100微米。
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