With the rapid development on fabrication of Integration Circuit Technology, Dry Etch has become one of the most major technology on the patterned etch.
随着集成电路制造技术的迅猛发展,干法刻蚀技术,早已在特征图形形成方面,成为最主要的工艺技术之一。
参考来源 - 金属刻蚀工艺开发与评价·2,447,543篇论文数据，部分数据来源于NoteExpress
The feasibility of using traditional dry-etch BARCs is very questionable because they introduce more process complexity and more defectivity and potentially cause unnecessary substrate damage.
传统的干法刻蚀不适合用于注入层，因为它的工艺复杂而且在刻蚀过程中可能导致基片损坏。
Based on ash chamber of metal etch this paper describes the full process of dry clean development and evaluation.
本文以金属刻蚀去胶腔为背景，简述干刻清洗工艺开发和评价过程。
An epitaxial deposition process including a dry etch process, followed by an epitaxial deposition process is disclosed.
本发明提供一外延沉积工艺，其包含干式蚀刻工艺与后续的外延沉积工艺。
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