Study the pulse electroplating coating's appearance and property with the direct current plating on the same current density, temperature and electroplating time.
并且与在相同电流密度、电镀温度及电镀时间下的直流电镀试样进行外观和性能的对比研究。
The results showed that as compared with direct current, revense pulse plating could obviously decrease porosity of nickel deposits.
结果表明，适当的脉冲参数可以明显降低镀层孔隙率。
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