芯片排出(Die Ejecting) 为了从晶圆带上成功地排出芯片，关键是定制排出冲头(eject chuck)(或帽)的尺寸和正确地将排出针(eject needle)间隔到芯片尺...
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Use constructional type of progressive dies, change present one step operation of single die construction for two-step blanking, i. e, first step semi-blanking, second ejecting material.
用级进模结构形式，改现行简单模结构的一工步操作的冲裁为两工步操作：第一工步为半冲裁，第二工步为推料。
As applications, two examples, which concern pouring temperature of nonferrous alloys and minimum ejecting angle recommended for die cavity, were given. The results showed that …
研究了有色金属压铸成型工艺模糊智能化设计中浇注温度和出模斜度的问题。
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