Since deep submicron manufacturing process is widely used in microprocessors, transient faults have become the main source of chip faults.

随着深亚微米工艺的广泛应用，瞬态故障已成为芯片失效的主要原因。

youdao

As the integrated circuit design has stepped into the deep ultra-submicron stage, the complexity of the circuit increases continually, chip test faces very huge challenge.

随着集成电路设计进入超深亚微米阶段，电路复杂度不断提高，芯片测试面临着巨大的挑战。

youdao