3 d shape model d图形模型
The 3-d evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理和焊点形态理论，建立了LCCC器件焊点三维形态预测模型。
Based on minimal energy principle, Evolving model of flip-chip 3-d shape prediction of MCM is established, and 3-d solder shape is effectively predicted.
基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。
The other is simplified crack model, which is used to describe the traverse crack, estimate approximately the free face farther field effect and match with the 1-D fixed shape wave.
其二描述直管的横向裂缝，建立了估算裂缝自由面远场效应、并与一维定型波模型匹配的简化裂缝模型。
应用推荐