铜锡合金电镀技术研究 关键词：电流密度；铜锡合金镀层；致密形；耐蚀性 [gap=3262]Keywords：current densrty；Cu-Sn plating；compactness；corrosion resistance
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Sn-Cu plating bath 锡铜电镀药水资料
Counter-flow spray technique for the treatment of the rinsing water containing pyrophosphates in Cu- Sn-Ni alloy plating is described.
电镀焦磷酸盐铜锡镍废水由“常流水”清洗方式改为反喷淋清洗方式。
Cu Sn plating is a right substitute for nickel coating because it is not allergic to human body, can meet anti diffusion requirement and has a lower cost.
电镀铜锡合金是一种合适的代镍镀层，它不使人体过敏，能满足防扩散性能的要求，且成本较低。
The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced.
介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件。
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