Production of copper plating technology commonly used by a copper with copper with coke, acid, phosphate copper with etc.
生产上常用的镀铜工艺有氰化镀铜、酸性镀铜、焦磷酸盐镀铜等。
Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit.
电镀铜层具有良好的导电、导热、延展性等优点，因此，电镀铜技术被广泛应用于电子材料制造领域。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
应用推荐