So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent.
用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。
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