专业释义英英释义
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化学镀铜 - 引用次数：40 参考来源 - 有机添加剂在印制电路板镀铜中的作用及其工艺研究镀铜
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化学镀铜 - 引用次数：12
The process parameters and solution ratio of electroless copper plating were researched by Orthogonal experimental Design, and the optimum parameters and processes were as follows. CF406A: 2.5g/L; CF406B: 7.5g/L; Temperature:30℃; Time: 20min.
化学镀铜方面:应用正交设计法研究了化学镀铜工艺参数和溶液配比,确定最佳参数和工艺:CF406A:2.5g/L;CF406B:7.5g/L;温度:30℃;时间:20min。
参考来源 - 六层刚挠结合板的研发及应用 -
红铜
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镀铜
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镀铜
·2,447,543篇论文数据，部分数据来源于NoteExpress
双语例句权威例句
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Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
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GRG, Copper plating, Stainless steel, Marble, Weathering steel, Custom carpet, Wood floors.
铜片，电镀不锈钢，大理石，耐候钢，定做地毯，实木地板。
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Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability.
镀铜：打底用，增进电镀层附着能力，及抗蚀能力。
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