... copper extrusion line 铜挤压机组 收藏 copper barrier layer 防铜渗镀层 收藏 copper(II) tellurite 亚碲酸铜（I） 收藏 ...
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Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit.
以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。
The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.
该锌-镍合金作为印制板用压延铜箔的阻挡层。
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