Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
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