The study indicates that the micro rectangle grooves flat heat pipe is characterized by high heat transfer capability with good prospects for cooling electronic components.
研究表明，微小矩形多槽道平板热管具有高传热特性，在电子器件冷却等方面有良好的应用前景。
For efficiently cooling electronic components, experiments were conducted to study the pool boiling heat transfer performance of FC-72 over silicon chips with surface microstructures.
针对电子器件的高效冷却问题，对表面加工有微结构的硅片上FC - 72的池沸腾换热性能进行了实验研究。
Aiming at the thermal design problem of high-power components in electronic equipments, this paper introduces one practical thermal design method of forced air cooling of electronic equipment.
针对电子设备中高功率器件的热设计问题，介绍了一种实用的强迫风冷散热设计方法。
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