中国有色金属学报 2003年12月 关键词: 复合电铸； 碳化硅颗粒； 铜基复合材料 [gap=1268]Key words: composite electroforming; SiCp; copper-based composites
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Composite electroforming is the combination of composite electrodeposition and Electroforming, which is referred to the process that solid particles or fibers co-deposit with single metal or alloy in electrolyte.
复合电铸是复合电沉积技术与电铸技术的结合，即在单金属电铸或合金电铸铸液中悬浮固体颗粒或纤维，使其与金属离子共沉积，获得夹杂弥散强化粒子或纤维的电铸层的工艺过程。
参考来源 - 镍—纳米氧化镧复合电铸试验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The micro-hardness of heat treated nano-composite electroforming deposits prepared under pulse current is markedly increased owing to the re-strengthening effect.
由于再强化效应的作用，经过热处理后的纳米复合电铸层，尤其是由脉冲电沉积所得纳米复合电铸层，其显微硬度的提高程度尤为明显。
The surface morphology and energy spectrum of electroforming deposits were observed by SEM, and the effects of intermittent mixing on composite electrodeposition were discussed.
用SEM测定了两种复合电铸层的表面形貌并进行了表面能谱分析，探讨了间歇搅拌对复合共沉积过程的影响。
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