The principle and structure design of temperature compensation package for FBGs are expatiated, temperature characteristic of packaged FBGs is measured.

阐述了温度补偿封装技术的基本原理和结构设计方法，并对封装后的光栅作了温度性能测试。

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Through the design of bending die for the back hoop of silencer, die design analysis and die structure for large cylinder part considering springback compensation was introduced.

通过对消音器后环箍弯曲成形模的设计，介绍了考虑弹复补偿后，较大圆筒件成形模具的设计分析和模具结构。

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Based on the analyzing of coupling property, the design steps of cascade compensation decoupling method are proposed. The structure to realize fuzzy decoupling is given.

本文在分析耦合特性的基础上，绐出了串联补偿解耦方法的设计步骤和实现模糊解耦的控制系统结构。

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