...时间 2.10.3 常见问题 显影过度 显影不净 阻焊入孔 下油不良 字符不清 8 待喷锡 (Waiting for HAL) 预涂助焊剂 (Coating Solder) 喷锡前处理 (HAL Pre-treating ) 喷锡 (Hot Air Leveling) 自检 (Self-inspection) QC 检查 (QC Inspection) 喷锡后处理 (HAL A...
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Solder Coating 喷锡 ; 焊锡涂敷 ; 锡涂敷
Solder coating is thin 上升速度慢
Solder coating is thick 上升速度快
solder electroplating coating 可焊性镀层
SnCu solder alloy coating SnCu钎料镀层
Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
In the test the solder ability plating coating.
在测试电镀镀层的焊锡能力。
In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。
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