integrated circuit package 集成电路组装 ; [电子] 集成电路组件 ; 成电路组件
Integrated-Circuit Package Antenna 集成电路封装天线
integral circuit package 集成电路组件
hybrid integrated circuit package 集成电路外壳
Conduction-cooled circuit package 发明名称
Integrated circuit package structure 发明名称
Fluid-cooled integrated circuit package 发明名称
package circuit 浇铸电路 ; [电子] 浇注电路
integrated circuit Flip Chip package 成电路板叩焊晶片
The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
散热片与集成电路封装热接触用于在工作过程中提取热量。
The invention involves the integrated circuit package domain, to be specific, involves when galvanizes to the base pin, prevents the permutation reaction the method.
本发明涉集成电路封装领域，具体地说，涉及对管脚电镀时，防止置换反应的方法。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
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