The chip includes an active proteinase film, screened chemical arrays distributed on the film and substrate microarrays.
这种化合物阵列芯片由活性蛋白酶膜、化合物阵列及底物微阵构成。
The package includes a chip carrier which has a metal substrate.
所述封装包括有金属基片的芯片支座。
The second bumps are disposed between the second chip and the joint substrate so that the second chip can be connected with the joint substrate electrically.
以及多个第二凸块,配置在所述第二芯片与所述对接基板之间,使所述第二芯片透过所述第二凸块与所述对接基板电性连接。
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