The finite element method was used for analysis of heat stress in chip on board (COB).
本文采用有限元法分析了板上芯片(COB)的热应力分布。
The finite element method was used for analysis of heat stress in chip on board(COB).
本文采用有限元法分析了板上芯片（COB）的热应力分布。
Based on fracture mechanics and finite element theory, calculation and analysis stress intensity factor of fiber asphalt chip seal under different conditions.
基于断裂力学和有限元原理，计算分析了纤维沥青碎石封层路面结构在不同条件下的应力强度因子。
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