Multi chip package technology 多芯片堆叠封装技术
In this paper, the merits and demerits, the key technology, the recent development and the developmental prospects for chip stacking and package stacking are introduced.
文章介绍了芯片堆叠和封装堆叠的优缺点、关键技术、最新动态和发展前景。
Introduced the package technology and technical standards for management of chip components and devices.
介绍了片式元器件的先进包装技术以及管理上所采用的技术标准。
Discussed are the crucial components for the performance of this LED package as the underlying chip technology, the suitable package design and the fitting primary optics.
讨论与此种LED封装性能密切相关的议题：基础的芯片技术、合适的的封装设计和初级光学元件。
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