After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.

通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。

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Last year, Dutch chip-maker NXP released a new type of mobile audio component -- the TFA9887 -- that allowed a mobile device to monitor its speaker system in real-time in order to max out volume without risking damage to the driver.

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