A new technology for chemical polishing of copper in weak alkaline solution has been developed and a brightener (containing corrosion inhibitor and surfactant) has been found out.
开发出了弱碱性溶液中紫铜化学抛光新工艺，确定了抛光液中的光亮剂(包括缓蚀剂和表面活性剂)。
This paper studies the technology of stainless steel chemical polishing under low temperature and introduces the functions of partial components in polishing solution.
研究了不锈钢在低温条件下的化学抛光工艺。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
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