A new technology for chemical polishing of copper in weak alkaline solution has been developed and a brightener (containing corrosion inhibitor and surfactant) has been found out.
开发出了弱碱性溶液中紫铜化学抛光新工艺，确定了抛光液中的光亮剂(包括缓蚀剂和表面活性剂)。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
ATS ADDCOPPER CT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
The preparation of nano-copper powders by chemical reduction were studied under ultrasonic field in the solution.
对超声场辅助增强作用下的液相化学还原法制备纳米级铜粉的工艺过程和条件进行了研究。
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