非导体金属化除了电镀(Electroplating)门径外还有如真空电镀(vacuum metalizing)、 阴极溅射法 ( cathode sputtering )及金属喷洒法(metal spraying).
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cathode sputtering atomizer 阴极溅射原子化器
cathode sputtering equipment 阴极溅射设备
cathode sputtering chamber 阴极溅射室
cathode sputtering theory 阴极溅射理论
cathode sputtering coating 阴极溅射镀膜
sputtering hollow cathode discharge 溅射型空心阴极放电
sputtering cathode 阴极溅散
A new net-shape cathode sputtering target which has a simple structure and a high sputtering rate was put forward.
设计了一种网状阴极溅射靶，它是由多个空心阴极并列交叉组合而成。
It has the characteristic of working on higher pressure and lower voltage and having a high cathode sputtering rate.
它具有工作气压高，维持电压低，阴极溅射率高等特点。
A new multiple hollow cathode sputtering target which has a simple structure and a high sputtering rate, was put forward.
研制了一种由多个空心阴极并列组合而成的可直接作为溅射靶的多重空心阴极溅射靶。
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