The result proved the cap-heatspreader structure could cool the chips effectively. Comparing with the whole metal plane,the cap-heatspreader structure could reduce weight effectively.
通过对比分析散热帽结构和常见散热结构的重量,得出了散热帽结构可以有效减重的结论。
参考来源 - 一种星载电子设备散热结构的设计与优化·2,447,543篇论文数据,部分数据来源于NoteExpress
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