... volume resistivity体绩电阻率. bumping process凸块制程. zero centering中间不变(叠正当). ...
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关键词:SiP系统封装；半导体装配和电路板装配；超细间距元件的锡膏印刷；植球工艺(Bumping Process)；浓缩和融合 2 系统封装（SiP）的定义和市场讯息
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bumping process
碰撞过程
以上为机器翻译结果，长、整句建议使用 人工翻译 。
Dr Rivalan and his colleagues have shown that this long-winded process gives the market so much time to respond that bumping animals up from Appendix II to Appendix I can do more harm than good.
ECONOMIST: Protecting endangered species less could help save them
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