Bulk silicon 块状硅
bulk silicon MEMS 体硅MEMS
bulk silicon process 体硅工艺
bulk-silicon cmos 体硅cmos
bulk silicon cmos 体硅cmos
Bulk-silicon LDMOS 体硅LDMOS
bulk silicon wafer 体硅圆片
bulk silicon MOSFETs 体硅MOSFET
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The sensor combines integrated bulk hall cell technology and instrumentation circuitry to minimize temperature related drifts associated with silicon hall cell characteristics.
该传感器将集成大量霍尔元件技术和进行信号调理的仪表电路整合在一起，从而使与硅霍尔元件特性相关的温度漂移降到最小。
The first is formed with monolayer bulk silicon structure, the others use the silicon on glass bonding structures.
水平驱动光开关采用单层体硅结构，另外两种光开关都采用了硅-玻璃的键合结构。
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