The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
The assembly which holds the vacuum cups, level arm and tail stop. It also moves the board in and out of the machine.
带真空吸盘、平稳臂和尾部止点的组合装置。它还负责将板材装入机器和从机器中取出来。
The diagram, schematic and layout are often attached to the top level board assembly.
该原理图，示意图和布局图往往附着在顶端的板组装件中。
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