The football player threw a block that knocked the ball-carrier out of bounds.
那足球运动员飞身阻挡对方的带球队员,把他摔到了场外。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
It comprises setting-ball carrier, latch collar and baffle.
由送球器、锁紧座、挡板组成。
应用推荐