atomic bond strength 原子键合强度 ; 原子键强度
covalent atomic bond 共价原子键
atomic bond mechanism 原子键机理
bond atomic 原子键
atomic c bond 原子键
Metal manufacturing technology is a process contains multiscale coupling phenomenon where fracture of atomic bond in the microscopic area will lead to the material removal in the macroscopic area.
金属切削工艺是一种隐含着微观和宏观之间耦合作用的过程,微观局部原子间化学键的断裂将会最终导致材料的宏观去除。
Now, it has been applied to calculating atomic and molecular polarization rate, susceptibility, total energy, bond energy etc.
目前已被广泛用来计算原子和分子的极化率、磁化率、总能量、键能等。
The variation of electronic structure leads to the increase of single bond radius and atomic volume and other changes of physical properties.
电子结构的转变是导致原子单键半径增大和体积增加及其他物理性质发生改变的根本原因。
So what I want to point out with this case in beryllium is that you don't have to use all of the electrons to figure out the bond order, and in fact, once you get to molecules 10 that are from atoms with atomic numbers of 8 or 10, you're not going to want to maybe draw out the full molecular orbital diagram.
我要指出的是,在Be这种情况下,你不需要利用,所有的电子来指导键序,实际上,一旦分子中,原子序数到达了8或者,你也许不想画出,整个分子轨道图。
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