从镍磷化学镀的反应机理出发，讨论了反应中影响磷沉积速率和镀层中磷含量的主要因素，试验制备了含磷量较高且抗蚀性良好的镍磷镀层。
The chemical Ni P plating mechanism in acid baths and the major aspects which influence the plating rate and P content of Ni P alloy coatings were discussed.
对低磷化学镀镍的影响因素进行了初步研究。
The influence factor on low-phosphorous electroless nickel plating is studied.
在制备泡沫镍材料的过程中，首先要求在聚氨酯海绵基体上低磷化学镀镍制备导电层。
As an initial stage on the process of foamed nickel preparation, a layer with low phosphorus content nickel deposit is applied on polyurethane foam substrate as a conducting layer.
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