为了获得电镀的最佳结果，在生产中对珍珠镍、光亮镍、酸性铜和黄铜四种镀液的成分参数进行了统计分析。
The component data of pearl nickel, bright nickel, acidic copper and brass plating solution in production were analyzed when the best result of the plating deposit obtained.
应用化学镀层法对改性后的CNT镀镍、铜及镍铜混合镀层技术进行了一系列研究。
The plating (layers) such as Ni, Cu and Ni-Cu formed on the CNTs surface by chemical plating process were investigated.
用化学镀法制备了镍包铜粉，并利用固相烧结法将镍包铜粉成功地制成了块状烧结体。
Nickel plat copper powders were prepared by electrolytic plating and bulk sinters of nickel-coated copper powders were prepared by sintering.
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