对锡-铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。
Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.
介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡-铅合金镀层的性能及制备工艺。
Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
应用推荐