基于这种机理，应用微观接触力学和磨粒粒度分布理论建立了一种新的表征CMP过程材料去除速率的数学模型。
Based on this mechanism, a new mathematical model characterizing the material removal rate in CMP process was developed by using micro-contact mechanics and particle size distribution theory.
采用电子碰撞理论计算了点面式高压脉冲电晕放电过程中的臭氧产生速率。
The formation rate of ozone due to the point-to-plate pulsed high-voltage corona discharge was calculated with electronic collision theory.
在理论上描述了静态破裂剂水化过程中体积增长率与水化反应速率成正比、与体系孔隙率成反比的关系式。
The volume growth rate in proportion with hydration reaction rate and in contrast to void ratio in hydration course was described.
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