作为VLS I互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。

Consequently, the metal interconnects of VLSI have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes.

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改善配对模式以让玩家能更频繁地被配对至互相连线较良好的其他玩家。

Improvements to matchmaking so players that have good connections to each other are matched together more frequently.

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