在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。

For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.

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综述了二元光学元件的常用制作工艺技术，包括台阶刻蚀法、薄膜沉积法、直接写入法、准分子激光加工法和灰阶掩模法。

The common fabrication technologies of binary optical elements were expatiated, including etching, thin-film deposition, direct writing, excimer laser projection and gray-scale masks.

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概述了综合运用薄膜线路技术、喷墨打印技术和激光钻孔技术以及采用常规技术制作LTCC基板的简要工艺。

Technics of LTCC MLB processing using thin film circuit technology, ink-jet printing, laser drilling, and conventional manufacturing methods is introduced.

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