...然涌出 •芯片连接基板 •为塑封料提供支撑 •提供芯片到线路板的电及热通道 引线框架构成：芯片焊盘，引脚 芯片焊盘(die paddle): 在封装过程中为芯片提供 机械支撑 引脚(lead finger): 连接芯片到封装外的电学通路 内引脚：与芯片上的焊盘通过引线相连 管脚：...
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超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
本课题的目的在于如何保护湿法腐蚀中芯片的焊盘和结构。
The purpose of this paper is to find ways to protect the pad and the structures on chip during the wet etching.
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