塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。
First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.
分析结果表明：加捻纤维束构成的复合材料，由于纤维适当加捻，可以大大减弱纤维与基体各具不同的热膨胀系数而产生的固化残余应力。
The analytical results show that the curing residual stresses of the twisted fiber composites in which there are different coefficient of thermal expansion due to curing can be decreased greatly.
根据具有不同温度膨胀系数的材料遇热变形不同的原理，设计了该热控系统的关键部件-热开关。
Base on the theory of differential thermal expansion between the two materials having different CTE values, a thermal switch as a crucial part in the thermal control system is designed.
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