四、镀铜4.1制程纲的彼制程或者称线路电镀(Pattern Plating),有别于齐板电镀(Panel Plating)4.2制造淌程现在两次铜功课简直皆因此龙门式主动电镀线为主,是垂直浸镀方法,上下料则采手动或主动...
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综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
适用于：酸性电镀铜、线路板、电铸模、制版电镀等。
Apply to: apply to: acid electroplated copper electric circuit board electroforming mould and electroplating for printing plate making etc.
我们引入了这套电镀仪电镀笔组合，不需专业技术人员，便可轻易修补线路板的电镀金位置。
We have introduced a set of electroplating electroplating pen instrument portfolio, without professional technical staff, can easily repair the circuit board electroplating gold position.
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