由于等离子体是一种具有很高能量和极高活性的物质，它对于任何有机材料等都具有良好的蚀刻作用，因而在最近几年也被引用到印制电路板制造中来。
The plasma is a high energy and high activity material, it has good etching effect for any organic material, which in recent years has also been referenced to the printed circuit board manufacturing.
由于它的优点，如高蚀刻率、高选择性、无碳蚀刻和最小限度的残留污染，电子工业把它用在等离子和热清洁应用中。
The electronics industry uses it in plasma and thermal cleaning applications for its advantages such as high etch rates, high selectivity, carbon-free etching, and minimal residual contamination.
然而，对一个宽槽来说，由于等离子区内边界层的变形，其蚀刻宽度会随着蚀刻深度的增加而增加。
However, for a wide trench, the width of etched profile will increase with the increase of its depth since the deformation of boundary layer in plasma.
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